Home
IC Chemical Processing
IC Failure Analysis
FIB Application
ESD/Latch-up Test
 
 
   芯片失效分析 →
SEM&EDX
Probe Station Application
EMMI Application
OBIRCH Application
LC液晶热点侦测
IC Grinding:Positioned/None-positioned
De-Gold Bump
X-Ray Application
SAM Application
 
LC Application
利用液晶感测到IC漏电处分子排列重组,在显微镜下呈现出不同于其它区域的斑状影像, 找寻在实际分析中困扰设计人 员的漏电区域(超过10mA之故障点)。LC可侦测因ESD,EOS应力破坏导致芯片失效的具体位置。

(请参阅EMMI,OBIRCH 相关内容)

.

 
    LC / EMMI / OBIRCH 对比
    灵敏度 背面观察 现象
  LC 毫安级别 No No Hot Spots
  EMMI 微安级别 No Light Emission
  OBIRCH 微安级别 Yes Thermo-electric Property
  Copyright (c) 2006 Perfictlab.com. All rights reserved.